The heat conduction gasket has excellent thermal conductivity and electrical insulation performance, can be used for a long period in the range of -50 ℃ -200 ℃, and has excellent compressibility and softness. It can meet the tolerance design of the heat dissipation structure parts and realize the good thermal conductivity of the interface. 

Characteristic

 thermal conductivity 1.2W/M K; 

accurate dimensional stability;

 excellent electrical insulation; 

use with low pressure; 

high anti-fire grade UL-94V0, does not contain toxic substances, comply with ROHS regulations;

 Common specification: 300mm*50m/ volume 

product commonly used thickness: 0.23mm, 0.25mm, 0.3mm, 0.45mm 

> here table below the second page of the typical application method of soft silica gel thermal conductive materials good thermal conductivity, insulation, Soft and elastic, placed between the power heating device and the heat dissipation structure, the thermal efficiency of the power module is transmitted to the heat dissipation parts to achieve the system heat dissipation. Heat conduction gasket can be cut into arbitrary size and shape according to the requirements of the application environment to meet different design needs. The use of power supply modules and heat dissipation components between power devices such as CPU, GPU and semiconductors need to transfer heat to the shell or other radiators instead of polluting heat conductors